- High-definition image: Slanting/Bridge/Voids/Cold Solder/Bonding wire
- 90KV 5μm closed X-ray tube,with long life,maintenance in free
- 1.3 million high resolution digital flat panel detector
- 30 degrees observation
- Color image navigation, easy to use
- Automatic programming detection and automatic analysis NG or OK
- More modular panels observation point setting
1) Defect inspection in IC encapsulation, e.g.: layer separation, cracking, void, and line integrity.
2) Measuring chip size, measuring line curvature, measuring the proportion of solder area of components.
3) Possible defects in PCB manufacturing processes, e.g.: misalignment, solder bridge and open.
4) SMT solder short, cold solder, component shifted, solder insufficient, solder void inspection and measurement.
5) Defect inspection of open, short or abnormal connections that may occur in automotive wiring harnesses and connectors.
6) Inner rupture or hollow inspection in plastic or metal.
7) Battery stacking uniformity, electrode welding inspection.
8) Seed, biological material inspection etc.