- High-definition image: Slanting/Bridge/Voids/Cold Solder/Bonding wire
- 90KV 3μm (130 KV Optional)closed X-ray tube,long life time,maintenance in free
- 2.3 mllion high resolution digital flat panel detector
- 6 axis linkage system.
- 60 degrees observation
- Platform 360° rotation
- Color lmage Navigation & Mapping Navigation
- Mapping Mosaic Function. (optional )
- Scalable 3D module (Industrial CT Optional)
- Programmable Detection. (Optional )
1) Defect inspection in IC encapsulation, e.g.: layer separation, cracking, void, and line integrity.
2) Measuring chip size, measuring line curvature, measuring the proportion of solder area of components.
3) Possible defects in PCB manufacturing processes, e.g.: misalignment, solder bridge and open.
4) SMT solder short, cold solder, component shifted, solder insufficient, solder void inspection and measurement.
5) Defect inspection of open, short or abnormal connections that may occur in automotive wiring harnesses and connectors.
6) Inner rupture or hollow inspection in plastic or metal.
7) Battery stacking uniformity, electrode welding inspection.
8) Seed, biological material inspection etc.