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- Stable and Uniform Hot Air Heating System
- Lower Heater Adjustable
- Carbon Fiber Micro-crystalline Infrared Preheater
- High-Precision PID Temperature Control System
- High-Precision Optical Alignment System with Industrial High-Definition CCD (2MP)
- High-Resolution Touch Screen HMI Interface
- Automatic Placement, Soldering, Desoldering
- Built-In Pressure Testing Device to Protects the PCB
- Real-time Temperature Monitoring and Over-Temperature Protection.
- Emergency Stop Function
- SMD Feeding Device Support (Optional)
- Add a side camera, more clearly observe the rework process(Optional)
Application
Suitable for Normal SMD(BGA, QFP etc.) & Micro-SMD Components Repair, Support P08 Small pitch LED beads, Min. 0.5mm * 0.5mm IC.
| Greutate | 71 kg |
|---|---|
| Dimensiuni | 64 × 63 × 92 cm |
| Operation Mode | Automatic / Optical /Touch Panel |
| Voltage/Power | AC220V±10%(110V Optional), 50/60HZ / Top: 1200W, Bottom: 1200W, IR: |
| Heating Mode | Top/Bottom Nozzle Hot Air, Bottom Plates Infrared |
| Temperature Precision | 2-3 ℃ (1 Sensor Port) |
| Preheat Zone | 280×380mm |
| Optical Alignment Precision | 0.01MM |
| CCD Magnification | 5X~50X |
| LCD Display | 17〞1080P FHD LCD Display |
| For PCB Size/Chip Size | PCB Size: 415*370MM~6*6MM / Chip Size: 0.6*0.6~40*40M |
| Standard Wooden Packing | Packing Size: L750*W700*H950 (MM) / G.W: 120KG |
